CAPITAL ADVANCED TECHNOLOGIES US3014

MANUFACTURER:
CAPITAL ADVANCED TECHNOLOGIES

PART:
US3014

DESCRIPTION:
UNI-SIP PCB PROTOTYPING BREADBOARD; PITCH SPACING:2.5MM; BOARD MATERIAL:FR4 EPOXY GLASS; BOARD THICKNESS:0.79MM; BODY MATERIAL:FR4 EPOXY GLASS; EXTERN

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