FARNELL B72510T300K62

MANUFACTURER:
FARNELL

PART:
B72510T300K62

DESCRIPTION:
HEAT SINK, MULTIFIN, 0.7°C/W; IC / TRANSISTOR PACKAGE / CASE:PGA; THERMAL RESISTANCE:0.7°C/W; EXTERNAL WIDTH:60MM; HEIGHT:16MM; HEATSINK MATERIAL:ALUM

Retail Pricing: $39.90

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