FARNELL MRS25931K1

MANUFACTURER:
FARNELL

PART:
MRS25931K1

DESCRIPTION:
HEAT SINK, 30X30X6MM; IC / TRANSISTOR PACKAGE / CASE:BGA; THERMAL RESISTANCE:9.96°C/W; EXTERNAL WIDTH:30MM; HEIGHT:6MM; HEATSINK MATERIAL:ALUMINIUM; E

Retail Pricing: $2.73

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